FPC

FPC

Stretching the limits for various materials

Solutions for highly interesting, diversified markets

The market for flexible printed circuit devices (FPC) is growing fast. In addition to the already established materials, the spotlight is increasingly falling on heat resistant thermoplastic polymer films. Materials such as PI, PEEK, PEI, PES, PPS, PPSU and PSU have been oriented on the laboratory stretching unit in Brückner’s technology centre. The resulting trials have achieved excellent results.

During evaluation, attention was paid to the semi-crystalline PEEK. By stretching high temperature PEEK thermoplastic film, not only was a considerable improvement of the mechanical properties achieved, but a significant increase of the shrinkage characteristic at high temperature also became evident. During the course of Brückner`s basic trials, simultaneous orientation of BO-PEEK films was performed and resulted in a significant improvement of the mechanical and thermal characteristics.